Capability
Strategic Autonomy: Hidden Champions and the European PCB and Advanced Packaging Capability Gap
What is the central argument of “Strategic Autonomy”, and why does it matter for European defence and dual-use markets?
Strategic Autonomy: Hidden Champions and the European PCB and Advanced Packaging Capability Gap: The foundation of European strategic. Defence-finance analysis…
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Original DFM publication · DFM Analysis report · 2026-01-21
The foundation of European strategic autonomy is increasingly dictated by the physical layer of the digital ecosystem, specifically Printed Circuit Boards (PCBs) and advanced packaging. While high-level policy often focuses on semiconductor design, the manufacturing of these physical substrates remains a critical bottleneck for the European Defence Technological and Industrial Base (EDTIB).
Modern military platforms, ranging from active electronically scanned array (AESA) radars to satellite communication suites, require high-density interconnect (HDI) solutions to function reliably.
This analysis answers: What is the central argument of “Strategic Autonomy”, and why does it matter for European defence and dual-use markets? What does this mean for European defence funding, procurement and investment decisions? How mature and defensible is the position described in “Strategic Autonomy”? Which European actors, programmes and funding instruments are most exposed?
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Original DFM analysis
Strategic Autonomy: Hidden Champions and the European PCB and Advanced Packaging Capability Gap
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What is Strategic Autonomy: Hidden Champions and the European PCB and Advanced Packaging Capability Gap?
Modern military platforms, ranging from active electronically scanned array (AESA) radars to satellite communication suites, require high-density interconnect (HDI) solutions to function reliably.
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