Solidify the European FDSOI Ecosystem Accelerating its Industrial Deploymentcore
SOIL · Horizon Europe grant · 2024-06-01–2027-05-31
EC contribution
Total cost
Beneficiaries
About the data
Source: CORDIS (official EU open data), Horizon Europe. Framework HORIZON · call HORIZON-KDT-JU-2023-1-IA · scheme HORIZON-JU-IA · topic HORIZON-KDT-JU-2023-1-IA-Topic-1. CORDIS record →
Objective
The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedded non-volatile memories and exceptional radio frequency capabilities. The objective of the SOIL project is to extend FDSOI technology platforms and broaden their use within the European industry in order to provide Europe with a real alternative to semiconductor supply autonomy using FDSOI semiconductors.We will thus expand a European technology manufactured by European players and suited to the European and Worldwide market.The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe.The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition.SOIL will expand the family of European FDSOI technology platforms by developing production and innovation capabilities in the following key areas:i) Advanced features: prepare next generation of FDSOI technologies and components;ii) Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the supply chain around FDSOI manufacturing;iii) Digital, analog & RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar).The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology.SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.
Beneficiaries (37)
| Organisation | Country | Role | EC contribution | SME |
|---|---|---|---|---|
| STMICROELECTRONICS CROLLES 2 SAS | FR | coordinator | €1,492,176 | |
| COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES | FR | participant | €6,727,330 | |
| SOITEC SA | FR | participant | €3,028,650 | |
| STMICROELECTRONICS FRANCE | FR | participant | €1,794,266 | |
| ROBERT BOSCH BV | NL | participant | €1,284,175 | |
| STMICROELECTRONICS (ALPS) SAS | FR | participant | €1,275,187 | |
| STMICROELECTRONICS ROUSSET SAS | FR | participant | €969,132 | |
| INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM | BE | participant | €750,886 | |
| ISD LYSEIS OLOKRIROMENON SYSTIMATONANONYMOS ETAIREIA | EL | participant | €689,250 | Yes |
| STMICROELECTRONICS GRENOBLE 2 SAS | FR | participant | €674,908 | |
| IMST GMBH | DE | participant | €620,011 | Yes |
| AED VANTAGE GMBH | DE | participant | €528,749 | Yes |
| FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV | DE | participant | €370,849 | |
| UNIVERSITATEA NATIONALA DE STIINTASI TEHNOLOGIE POLITEHNICA BUCURESTI | RO | participant | €365,634 | |
| SIAE MICROELETTRONICA SPA | IT | participant | €360,750 | |
| UNIVERSITE CATHOLIQUE DE LOUVAIN | BE | participant | €348,250 | |
| INSTITUT POLYTECHNIQUE DE GRENOBLE | FR | participant | €311,654 | |
| SILVACO FRANCE | FR | participant | €300,000 | Yes |
| INSTITUT POLYTECHNIQUE DE BORDEAUX | FR | participant | €299,376 | |
| TECHNISCHE UNIVERSITEIT EINDHOVEN | NL | participant | €288,084 | |
| CITROBITS GMBH | DE | participant | €217,125 | Yes |
| ION BEAM SERVICES | FR | participant | €201,124 | Yes |
| UNIVERSITA DELLA CALABRIA | IT | participant | €189,000 | |
| DESIGN AND REUSE SA | FR | participant | €186,300 | Yes |
| ANTENNEX BV | NL | participant | €175,500 | Yes |
| USTAV TEORIE INFORMACE A AUTOMATIZACE AV CR VVI | CZ | participant | €144,900 | |
| ECOLE CENTRALE DE LYON | FR | participant | €101,609 | |
| INSTITUT MIKROELEKTRONICKYCH APLIKACI SRO | CZ | participant | €78,200 | |
| IC-LOGIC GMBH | DE | participant | €56,250 | Yes |
| THALES ALENIA SPACE FRANCE SAS | FR | participant | €13,000 | |
| GREENWAVES TECHNOLOGIES DFM profile | FR | participant | €0 | Yes |
| UNIVERSITE DE BORDEAUX | FR | thirdParty | €0 | |
| UNIVERSITE GRENOBLE ALPES | FR | thirdParty | €0 | |
| SOITEC LAB | FR | thirdParty | €0 | |
| NEWAYS ADVANCED MICROSYSTEMS BV | NL | participant | €0 | |
| EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICH | CH | associatedPartner | — | |
| ARGUS SPACE AG | CH | associatedPartner | — | Yes |
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