Sustainable production line delivering advanced packaging for space missionscore
SUPERPACS · Horizon Europe grant · 2026-06-01–2030-05-31
EC contribution
Total cost
Beneficiaries
About the data
Source: CORDIS (official EU open data), Horizon Europe. Framework HORIZON · call HORIZON-CL4-2025-02 · scheme HORIZON-RIA · topic HORIZON-CL4-2025-02-SPACE-74. CORDIS record →
Objective
To secure EU non-dependence in critical space electronics, the SUPERPACS consortium will build a European supply chain for advanced packaging technologies such as silicon interposer and ultra high-density organic interposers. Reduced line width and spacing (below 5 µm) for very-high-density integration, smaller form factors and improved mass/power efficiency will unlock chiplet-based devices such as RF integrated circuits, digital to analog converters, digital core or high bandwidth memories to be implemented into advanced System in Package.The SUPERPACS project pursues two complementary concepts: Silicon interposer and an ultra-high-density organic carrier to accelerate demonstration while mitigating IP and manufacturability risks. It mobilises an open “SIPACK” pilot line to validate an industrial route at 1,000-100,000 SiP modules per year, anchoring a European supply chain from material to module and supporting dual-use markets. SUPERPACS covers the full sequence from material selection & characterisation, design & simulation, fabrication & assembly, to testing, reliability and validation. Target application domains are Galileo, EGNOS, Copernicus, SST and IRIS², allowing the project to advance from initial TRL 3-4 to TRL 6-7 for Navigation, Earth Observation and Telecommunication.The SUPERPACS consortium consists of experienced space actors, independent research institutes and test labs, and technology providers for both commercial and high-reliability applications. The work plan consists of determining the SiP requirements for space, developing Si interposer and organic UHDI interposer technology, combined assembly of components and submitting the respective test vehicles and demonstrators to reliability testing up to TRL6. For risk mitigation, two design/manufacturing/test cycles will be implemented supported by APQP MRL/TRL assessment techniques. Finally, for broader impact on the project output, a SiP design kit will be presented at the end of the project.
Beneficiaries (7)
| Organisation | Country | Role | EC contribution | SME |
|---|---|---|---|---|
| INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM | BE | coordinator | €349,750 | |
| THALES ALENIA SPACE FRANCE SAS | FR | participant | €600,028 | |
| IHP GMBH - LEIBNIZ INSTITUTE FOR HIGH PERFORMANCE MICROELECTRONICS | DE | participant | €599,894 | |
| AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT | AT | participant | €589,968 | |
| SYNERGIE CAD PSC | FR | participant | €518,736 | |
| AMU NORDJYLLAND | DK | participant | €377,236 | |
| THALES ALENIA SPACE ITALIA SPA | IT | participant | €247,125 |
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