Silicon-Rich Materials for Advanced Semiconductor Fabricationbroad
IO-PR · Horizon Europe grant · 2023-08-01–2025-12-31
EC contribution
Total cost
Beneficiaries
About the data
Source: CORDIS (official EU open data), Horizon Europe. Framework HORIZON · call HORIZON-EIC-2023-ACCELERATOR-01 · scheme HORIZON-EIC-ACC-BF · topic HORIZON-EIC-2023-ACCELERATOROPEN-01. CORDIS record →
Objective
Semiconductor chips empower all modern digital technology and are an integral part of our lives. Only a handful of companies can produce them in their advanced forms or equipment and materials for the nanometers-scale precision required for their manufacture. To further improve semiconductor chips performance, a process called Extreme Ultraviolet lithography (EUVL) is required. PiBond is one of two companies globally who have innovated inorganic EUVL materials meeting future needs. Yet, the development of materials, which enable the formulation chip structures below 3nm node, is extremely challenging. It requires extreme molecular material control and outstanding quality and there is a myriad of challenges to overcome for a successful material and process. This high-risk project enables us to unlock a significant portion of advanced chips market of >500Bn€ and SAM of >3Bn€ in photoresist materials. Our project is critical for the EU goals in semiconductor manufacturing (Chips Act).
Beneficiaries (2)
| Organisation | Country | Role | EC contribution | SME |
|---|---|---|---|---|
| PIBOND OY | FI | coordinator | €2,487,240 | Yes |
| Pibond GmbH | DE | thirdParty | €0 |
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